Chip AI consultant
Technical parameters/power supply voltage (DC): | 2.50V (min) |
| ||||
Technical parameters/output current: | 17 mA |
| ||||
Technical parameters/power supply current: | 18.7 µA |
| ||||
Technical parameters/number of circuits: | 2 |
| ||||
Technical parameters/number of channels: | 2 |
| ||||
Technical parameters/Common Mode Rejection Ratio: | 75 dB |
| ||||
Technical parameters/input compensation drift: | 1.80 µV/K |
| ||||
Technical parameters/bandwidth: | 155 kHz |
| ||||
Technical parameters/conversion rate: | 80.0 mV/μs |
| ||||
Technical parameters/gain bandwidth product: | 155 kHz |
| ||||
Technical parameters/input compensation voltage: | 250 µV |
| ||||
Technical parameters/input bias current: | 1 pA |
| ||||
Technical parameters/operating temperature (Max): | 85 ℃ |
| ||||
Technical parameters/operating temperature (Min): | -40 ℃ |
| ||||
Technical parameters/gain bandwidth: | 155 kHz |
| ||||
Technical parameters/Common Mode Rejection Ratio (Min): | 75 dB |
| ||||
Technical parameters/power supply voltage: | 2.5V ~ 6V |
| ||||
Technical parameters/power supply voltage (Max): | 5.5 V |
| ||||
Technical parameters/power supply voltage (Min): | 2.5 V |
| ||||
Encapsulation parameters/installation method: | Surface Mount |
| ||||
Package parameters/number of pins: | 8 |
| ||||
Encapsulation parameters/Encapsulation: | SOIC-8 |
| ||||
Dimensions/Length: | 4.9 mm |
| ||||
Dimensions/Width: | 3.9 mm |
| ||||
Dimensions/Height: | 1.25 mm |
| ||||
Dimensions/Packaging: | SOIC-8 |
| ||||
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
| ||||
Other/Product Lifecycle: | Active |
| ||||
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCP607-I/SN
|
Microswitch | 类似代替 | SOIC |
MICROCHIP MCP607-I/SN 运算放大器, 双路, AEC-Q100, 155 kHz, 2个放大器, 0.08 V/µs, 2.5V 至 5.5V, SOIC, 8 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review