Chip AI consultant
Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Reduce System clock skew over the alternative CMOS and TTL technologies. |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC100EP32DG
|
ON Semiconductor | 完全替代 | SOIC-8 |
ON SEMICONDUCTOR MC100EP32DG 芯片, 逻辑芯片 - ECL, 除法器 ÷2
|
||
|
|
NXP | 完全替代 | TSSOP |
ON SEMICONDUCTOR MC100EP32DTR2G 集成电路, 预变换器(PRESCALER), TSSOP封装, 8针, 塑料
|
||
MC100EP32DTR2G
|
ON Semiconductor | 完全替代 | TSSOP-8 |
ON SEMICONDUCTOR MC100EP32DTR2G 集成电路, 预变换器(PRESCALER), TSSOP封装, 8针, 塑料
|
||
MC10EP32DG
|
ON Semiconductor | 完全替代 | SOIC-8 |
3.3/5V ECL ÷2 除法器
|
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