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Model HFBR-5963ALZ
Description HFBR-5963ALZ 收发器 **HFBR-5963LZ/ALZ** 多模式小型收发器提供一种用于快速以太网和 SONET OC-3/SDH STM-1 应用的解决方案。 收发器随附 LC 连接器和工业 2 x 5 DIP 封装。 应用包括多模式光纤 ATM 主干链路、快速以太网和 SONET/SDH 设备。 LC 连接器接口，带外部连接器屏蔽。 符合 RoHS 通过 62.5/125 mm 和 50/125 mm 多模式光纤操作 单 +3.3V 电源 兼容性：波焊和水冲洗过程 ISO 9001 完全符合 ATM Forum UNI SONET OC-3 多模光纤物理层规格 完全符合 FDDI PMD 标准光纤性能要求 完全符合 IEEE802.3u 100Base-FX 版本光纤性能要求 +3.3 V TTL 信号检测输出 温度范围：-40 °C 至 +85 °C HFBR-5963ALZ ### 光纤，Avago Technologies
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Brand: Broadcom
Packaging DIP
Delivery time
Packaging method
Standard packaging quantity 1
480.04  yuan 480.04yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9142) Minimum order quantity(1)
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Technical parameters/number of pins:

10

 

Technical parameters/wavelength:

1308 nm

 

Technical parameters/power supply voltage:

3.3 V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

10

 

Encapsulation parameters/Encapsulation:

DIP

 

Dimensions/Length:

48.19 mm

 

Dimensions/Width:

15.05 mm

 

Dimensions/Height:

10.8 mm

 

Dimensions/Packaging:

DIP

 

Physical parameters/operating temperature:

-40℃ ~ 85℃

 

Other/Product Lifecycle:

Active

 

Other/Manufacturing Applications:

Communications & Networking, Communication and Network

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
HFBR-5963LZ HFBR-5963LZ Broadcom 功能相似 DIP
Transceiver, 1270nm Min, 1380nm Max, LC Connector, Surface Mount, ROHS COMPLIANT, PLASTIC
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