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Technical parameters/rated voltage (DC): | 35.0 V |
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Technical parameters/operating voltage: | 35 VDC |
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Technical parameters/capacitance: | 47 µF |
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Technical parameters/Equivalent series resistance (ESR): | 0.26 Ω |
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Technical parameters/tolerances: | ±20 % |
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Technical parameters/Ripple current: | 300 mA |
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Technical parameters/operating temperature (Max): | 105 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/accuracy: | ±20 % |
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Technical parameters/rated voltage: | 35 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Height: | 5.8 mm |
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Dimensions/Diameter: | 6.30 mm |
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Dimensions/Packaging: | SMD |
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Physical parameters/medium materials: | Aluminum Electrolytic |
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Physical parameters/operating temperature: | -55℃ ~ 105℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Cut Tape (CT) |
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Other/Minimum Packaging: | 1000 |
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Other/Lifespan (hours): | 2000h @105℃ |
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Other/Manufacturing Applications: | Consumer Electronics, Industrial, Portable Devices, Multimedia, Consumer Electronics, Industrial, Portable Equipment, Communication and Networking, Power Management, Automotive, Power Management, Automotive, Communications& Networking |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EEE-HDV470XAP
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Panasonic | 类似代替 | SMD |
PANASONIC ELECTRONIC COMPONENTS EEE-HDV470XAP 铝电解电容, 47uF, 35V, 20%, SMD
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