Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP-48 |
|
Dimensions/Packaging: | TSSOP-48 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90C365AMT/NOPB
|
National Semiconductor | 功能相似 | TSSOP-48 |
IC XMITTER PROGR LVDS 48-TSSOP
|
||
DS90CR215MTD/NOPB
|
TI | 完全替代 | TSSOP-48 |
TEXAS INSTRUMENTS DS90CR215MTD/NOPB 芯片, 接口桥接器, CMOS/TTL-LVDS, TSSOP48
|
||
DS90CR217MTD/NOPB
|
TI | 功能相似 | TSSOP-48 |
IC TXRX 21Bit CHAN LINK 48TSSOP
|
||
SN65LVDS95DGGREP
|
TI | 功能相似 | TSSOP-48 |
LVDS SERDES发送器 LVDS SERDES TRANSMITTER
|
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