Technical parameters/power supply voltage (DC): | 3.30 V, 3.60 V (max) |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 20 |
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Encapsulation parameters/Encapsulation: | TSSOP-20 |
|
Dimensions/Packaging: | TSSOP-20 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | 3A991 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC17512LSO20C
|
Xilinx | 完全替代 | SOIC-20 |
PROM Serial 512Kbit 3.3V 20Pin SOIC
|
||
XCF02SVOG20C
|
Xilinx | 完全替代 | TSSOP-20 |
XILINX XCF02SVOG20C 芯片, 存储器, PROM, 闪存平台, 2Mb, 20TSSOP
|
||
XCF04SVOG20C
|
Xilinx | 完全替代 | TSSOP-20 |
XILINX XCF04SVOG20C 芯片
|
||
XCF04SVOG20C
|
Xicor | 完全替代 | TSSOP |
XILINX XCF04SVOG20C 芯片
|
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