Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TRAY |
|
Dimensions/Packaging: | TRAY |
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Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W9864G6IH-6
|
Winbond Electronics | 功能相似 | TSOP-54 |
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54Pin TSOP-II
|
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