Technical parameters/frequency: | 500 kHz |
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Technical parameters/power supply voltage (DC): | 25.0V (max) |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/output voltage: | 15 V |
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Technical parameters/output current: | 200 mA |
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Technical parameters/power supply current: | 17 mA |
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Technical parameters/dissipated power: | 1 W |
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Technical parameters/Static current: | 11.0 mA |
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Technical parameters/adjusted output: | 1 |
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Technical parameters/rise time: | 50 ns |
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Technical parameters/switching frequency: | 500 kHz |
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Technical parameters/topology structure: | Boost |
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Technical parameters/duty cycle: | 50 % |
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Technical parameters/maximum duty cycle: | 50 % |
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Technical parameters/descent time: | 50 ns |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Technical parameters/power supply voltage: | 7.6V ~ 30V |
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Technical parameters/power supply voltage (Max): | 25 V |
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Technical parameters/power supply voltage (Min): | 12 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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