Chip AI consultant
Technical parameters/rated power: | 2.403 W |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/Input voltage (DC): | 6.50 V |
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Technical parameters/output current: | 5 A |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 2.4 W |
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Technical parameters/rise time: | 3000 µs |
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Technical parameters/Input voltage (Max): | 6.5 V |
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Technical parameters/input voltage (Min): | 2.5 V |
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Technical parameters/output current (Max): | 5 A |
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Technical parameters/number of inputs: | 1 |
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Technical parameters/descent time: | 800 µs |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 2403 mW |
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Technical parameters/input voltage: | 6.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SON-8 |
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Dimensions/Length: | 3.15 mm |
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Dimensions/Width: | 3.15 mm |
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Dimensions/Height: | 0.95 mm |
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Dimensions/Packaging: | SON-8 |
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Physical parameters/weight: | 0.0003841927628 kg |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | power management |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free Alternative material
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