Chip AI consultant
Technical parameters/output current: | ≤50 mA |
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Technical parameters/power supply current: | 1 mA |
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Technical parameters/number of circuits: | 2 |
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Technical parameters/number of channels: | 2 |
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Technical parameters/dissipated power: | 725 mW |
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Technical parameters/Common Mode Rejection Ratio: | 60dB ~ 96dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 5.1 MHz |
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Technical parameters/conversion rate: | 10.5 V/μs |
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Technical parameters/gain bandwidth product: | 5.1 MHz |
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Technical parameters/input compensation voltage: | 500 µV |
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Technical parameters/input bias current: | 2 pA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 5.1 MHz |
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Technical parameters/dissipated power (Max): | 725 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 70 dB |
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Technical parameters/power supply voltage: | 2.5V ~ 6V |
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Technical parameters/power supply voltage (Max): | 6 V |
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Technical parameters/power supply voltage (Min): | 2.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2772AIDG4
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TI | 类似代替 | SOIC-8 |
家庭的2.7高转换率轨至轨输出运算放大器，带有关断 FAMILY OF 2.7-HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
|
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TLV2772AIDRG4
|
TI | 类似代替 | SOIC-8 |
家庭的2.7高转换率轨至轨输出运算放大器，带有关断 FAMILY OF 2.7-HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
|
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