Chip AI consultant
Technical parameters/frequency: | 2.1 MHz |
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Technical parameters/power supply voltage (DC): | 2.00V (min) |
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Technical parameters/power supply current: | 360 µA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 725 mW |
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Technical parameters/Static current: | 170 µA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 725 mW |
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Technical parameters/power supply voltage: | 2V ~ 15V |
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Technical parameters/power supply voltage (Max): | 15 V |
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Technical parameters/power supply voltage (Min): | 2 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Automotive, Defense, Military, and Aviation |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standards/military grade: | Yes |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NE555DR
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS NE555DR 芯片, 单高精度定时器
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Rochester | 类似代替 |
TEXAS INSTRUMENTS TLC555CDR 芯片, 定时器
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