Technical parameters/operating voltage: | 5 V |
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Technical parameters/capacitance: | 350 pF |
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Technical parameters/rated power: | 300 W |
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Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/breakdown voltage: | 6 V |
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Technical parameters/number of channels: | 4 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 300 W |
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Technical parameters/clamp voltage: | 11 V |
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Technical parameters/Maximum reverse voltage (Vrrm): | 5V |
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Technical parameters/peak pulse power: | 300 W |
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Technical parameters/minimum reverse breakdown voltage: | 6 V |
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Technical parameters/maximum reverse leakage current (Ir): | 20uA |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/rated voltage (Max): | 11 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Minimum Packaging: | 2500 |
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Other/Manufacturing Applications: | General, Computer and Computer Peripherals, Industrial, Industrial, Computers& Computer Peripherals, Communications & Networking, Communication and Network |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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