Technical parameters/number of pins: | 2 |
|
Technical parameters/forward current: | 1 A |
|
Technical parameters/Maximum forward surge current (Ifsm): | 10 A |
|
Technical parameters/forward voltage (Max): | 660 mV |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature: | 150℃ (Max) |
|
Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | SOD-323 |
|
Dimensions/Packaging: | SOD-323 |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Cut Tape (CT) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG6010CEJ
|
NXP | 功能相似 | SOD-323 |
肖特基势垒二极管,1A 至 1.5A,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG6010CEJ
|
Nexperia | 功能相似 | SOD-323 |
肖特基势垒二极管,1A 至 1.5A,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG6010CEJ,115
|
NXP | 完全替代 | SOD-323 |
1A 至 1.5A,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器,NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG6010CEJ,115
|
Nexperia | 完全替代 | SOD-323 |
1A 至 1.5A,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器,NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
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