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Model PMEG2010BEA
Description 1A 至 1.5A，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
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Brand: NXP
Packaging SOD-323
Delivery time
Packaging method Cut Tape (CT)
Standard packaging quantity 1
0.33  yuan 0.33yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7416) Minimum order quantity(1)
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Technical parameters/forward voltage:

500 mV

 

Technical parameters/forward current:

1 A

 

Technical parameters/Maximum forward surge current (Ifsm):

10 A

 

Technical parameters/forward voltage (Max):

500 mV

 

Technical parameters/forward current (Max):

1 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-65 ℃

 

Technical parameters/working junction temperature (Max):

150 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

2

 

Encapsulation parameters/Encapsulation:

SOD-323

 

Dimensions/Length:

1.8 mm

 

Dimensions/Width:

1.35 mm

 

Dimensions/Height:

1.05 mm

 

Dimensions/Packaging:

SOD-323

 

Physical parameters/operating temperature:

-65℃ ~ 150℃

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Cut Tape (CT)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2014/12/17

 

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