Chip AI consultant
Technical parameters/rated voltage (DC): | 20.0 V |
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Technical parameters/rated current: | 1.00 A |
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Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/output current: | ≤1.00 A |
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Technical parameters/number of pins: | 2 |
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Technical parameters/forward voltage: | 530mV @1A |
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Technical parameters/polarity: | Standard |
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Technical parameters/thermal resistance: | 23℃/W (RθJL) |
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Technical parameters/forward current: | 1 A |
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Technical parameters/Maximum forward surge current (Ifsm): | 50 A |
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Technical parameters/forward voltage (Max): | 595 mV |
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Technical parameters/forward current (Max): | 1 A |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | DO-216AA |
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Dimensions/Length: | 2.05 mm |
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Dimensions/Width: | 2.18 mm |
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Dimensions/Height: | 1.15 mm |
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Dimensions/Packaging: | DO-216AA |
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Physical parameters/operating temperature: | 65℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Portable equipment, Computers& Computer Peripherals, Automotive, Computers and Computer Peripherals, Power Management, Portable Devices, Consumer Electronics, Communication&Networking, Power Management, Consumer Electronics, Communications& Networking, automotive |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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