Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 48 |
|
Encapsulation parameters/Encapsulation: | TSSOP-48 |
|
Dimensions/Packaging: | TSSOP-48 |
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Other/Product Lifecycle: | Not Recommended for New Designs |
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Other/Packaging Methods: | Rail |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90C365AMT/NOPB
|
National Semiconductor | 功能相似 | TSSOP-48 |
TEXAS INSTRUMENTS DS90C365AMT/NOPB 芯片, LVDS发送器, TSSOP-48
|
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