Chip AI consultant
Technical parameters/power supply voltage (DC): | 3.00V (min) |
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Technical parameters/data rate: | 1.80 Gbps |
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Technical parameters/input current (Min): | 10 μA |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | -10 ℃ |
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Technical parameters/dissipated power (Max): | 1630 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 56 |
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Encapsulation parameters/Encapsulation: | TSSOP |
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Dimensions/Packaging: | TSSOP |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Rail |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90C383BMT/NOPB
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National Semiconductor | 完全替代 | TSSOP-56 |
TEXAS INSTRUMENTS DS90C383BMT/NOPB 驱动器, LVDS, 发送器, 60 mA, -10 °C, 70 °C, 3 V
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