Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1023S-100+
|
Dallas Semiconductor | 功能相似 | SOIC |
MAXIM INTEGRATED PRODUCTS DS1023S-100+ 芯片, 延迟线
|
||
DS1023S-50+
|
Maxim Integrated | 功能相似 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS DS1023S-50+ 芯片, 延迟线
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review