Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC-20 |
|
Dimensions/Packaging: | SOIC-20 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DAC0832LCWM/NOPB
|
National Semiconductor | 功能相似 | SOIC-20 |
IC CONV D/A 8Bit DBL BUFF 20SOIC
|
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