Chip AI consultant
Technical parameters/power supply voltage (DC): | 22.0V (max) |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/drain source resistance: | 4.6 Ω |
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Technical parameters/polarity: | Dual N-Channel |
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Technical parameters/dissipated power: | 6 W |
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Technical parameters/threshold voltage: | 1.4 V |
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Technical parameters/drain source voltage (Vds): | 25 V |
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Technical parameters/Input capacitance (Ciss): | 920pF @12.5V(Vds) |
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Technical parameters/rated power (Max): | 6 W |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 6 W |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | LDFN-8 |
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Dimensions/Length: | 3.4 mm |
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Dimensions/Width: | 3.4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | LDFN-8 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ (TJ) |
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Other/Product Lifecycle: | Supply in progress |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Industrial, power management |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CSD87330Q3D
|
TI | 功能相似 | LSON-CLIP-8 |
30V 同步降压 NexFET™ 电源块
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