Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BQ2000TPW
|
TI | 完全替代 | TSSOP-8 |
具有 dT/dt 终端的开关模式多化合物电池充电器 8-TSSOP -20 to 70
|
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