Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | CDFM |
|
Dimensions/Packaging: | CDFM |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BLF6G27S-45,112
|
NXP | 功能相似 | SOT-608-3 |
Trans RF MOSFET N-CH 65V 20A 3Pin CDFM Bulk
|
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