Chip AI consultant
Technical parameters/capacitance: | 5.00 pF |
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Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/number of pins: | 5 |
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Technical parameters/forward voltage: | 1.25 V |
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Technical parameters/dissipated power: | 385 mW |
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Technical parameters/reverse recovery time: | 50 ns |
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Technical parameters/forward current: | 200 mA |
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Technical parameters/Maximum forward surge current (Ifsm): | 625 mA |
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Technical parameters/forward voltage (Max): | 1.25 V |
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Technical parameters/forward current (Max): | 200 mA |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/operating temperature: | 150℃ (Max) |
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Technical parameters/working junction temperature (Max): | 150 ℃ |
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Technical parameters/dissipated power (Max): | 385 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 5 |
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Encapsulation parameters/Encapsulation: | SC-70-5 |
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Dimensions/Length: | 2.2 mm |
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Dimensions/Width: | 1.35 mm |
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Dimensions/Height: | 1 mm |
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Dimensions/Packaging: | SC-70-5 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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