Chip AI consultant
Technical parameters/output current: | 8mA @5V |
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Technical parameters/power supply current: | 750 µA |
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Technical parameters/number of circuits: | 4 |
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Technical parameters/number of channels: | 4 |
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Technical parameters/dissipated power: | 1090 mW |
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Technical parameters/Common Mode Rejection Ratio: | 55 dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 2.40 MHz |
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Technical parameters/conversion rate: | 2.40 V/μs |
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Technical parameters/gain bandwidth product: | 3 MHz |
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Technical parameters/input compensation voltage: | 4.5 mV |
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Technical parameters/input bias current: | 1 pA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 3 MHz |
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Technical parameters/dissipated power (Max): | 1090 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 55 dB |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 9.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2375ID
|
TI | 类似代替 | SOIC-16 |
CMOS 运算放大器，LMV/TLV 系列 ### 运算放大器，Texas Instruments
|
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