Chip AI consultant
Technical parameters/power supply current: | 400 µA |
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Technical parameters/number of circuits: | 2 |
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Technical parameters/number of channels: | 2 |
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Technical parameters/dissipated power: | 725 mW |
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Technical parameters/Common Mode Rejection Ratio: | 70 dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 670 kHz |
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Technical parameters/conversion rate: | 550 mV/μs |
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Technical parameters/gain bandwidth product: | 710 kHz |
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Technical parameters/Over temperature protection: | No |
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Technical parameters/input compensation voltage: | 2.5 mV |
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Technical parameters/input bias current: | 1 pA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 0.71 MHz |
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Technical parameters/dissipated power (Max): | 725 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 70 dB |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
OPA2337UA
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS OPA2337UA 运算放大器, 双路, 3 MHz, 2个放大器, 1.2 V/µs, 2.5V 至 5.5V, SOIC, 8 引脚
|
||
TLC272BID
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS TLC272BID 运算放大器, 双路, 1.7 MHz, 2个放大器, 3.6 V/µs, 4V 至 16V, SOIC, 8 引脚
|
||
TLV2262ID
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS TLV2262ID 运算放大器, 双路, 710 kHz, 2个放大器, 0.55 V/µs, 2.7V 至 8V, SOIC, 8 引脚
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