Technical parameters/frequency: | 10 kHz |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/Input voltage (DC): | 1.50V (min) |
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Technical parameters/output voltage: | 36 V |
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Technical parameters/output current: | 20 mA |
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Technical parameters/power supply current: | 0.16 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 0.47 W |
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Technical parameters/output power: | 470 mW |
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Technical parameters/switching frequency: | 35 kHz |
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Technical parameters/Input voltage (Max): | 15 V |
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Technical parameters/input voltage (Min): | 1.5 V |
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Technical parameters/output current (Max): | 20 mA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 470 mW |
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Technical parameters/power supply voltage: | 3V ~ 30V |
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Technical parameters/power supply voltage (Max): | 15 V |
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Technical parameters/power supply voltage (Min): | 1.5 V |
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Technical parameters/input voltage: | 1.5V ~ 15V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.42 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tu Alternative material
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