Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP-16 |
|
Dimensions/Packaging: | TSSOP-16 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCA8574APW,118
|
NXP | 功能相似 | TSSOP-16 |
PCA8574APW,118 编带
|
||
PCA8574D,518
|
NXP | 功能相似 | SOIC-16 |
输入/输出扩展, 8bit, 400 kHz, I2C, 2.3 V, 5.5 V, SOIC
|
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