Technical parameters/power supply current: | 27 mA |
|
Technical parameters/clock frequency: | 40 MHz |
|
Technical parameters/dissipated power: | 0.6 W |
|
Technical parameters/access time (Max): | 10 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2.7V ~ 3.6V |
|
Technical parameters/power supply voltage (Max): | 3.6 V |
|
Technical parameters/power supply voltage (Min): | 2.7 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | DFN-8 |
|
Dimensions/Packaging: | DFN-8 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MR25H10CDC
|
Everspin Technologies | 完全替代 | DFN-8 |
MR25H10 系列 1 Mb 128 k x 8 3 V 串行 SPI 表面贴装 MRAM - DFN-8
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review