Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | HVQCCN |
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Dimensions/Length: | 4 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Packaging: | HVQCCN |
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Other/Product Lifecycle: | Unknown |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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National Semiconductor | 功能相似 | HVQCCN |
Conv DC-DC 3V to 5.5V Step Down Dual-Out 0.8V to 4.5V 2A 16Pin WQFN EP T/R
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