Chip AI consultant
Technical parameters/power supply voltage (DC): | 3.00V (min) |
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Technical parameters/rise/fall time: | 2.1ns, 1.7ns |
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Technical parameters/number of channels: | 4 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/dissipated power: | 111 mW |
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Technical parameters/rise time: | 2.8 ns |
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Technical parameters/isolation voltage: | 3000 Vrms |
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Technical parameters/input current (Min): | 10 μA |
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Technical parameters/descent time (Max): | 2.1 ns |
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Technical parameters/rise time (Max): | 2.8 ns |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 111 mW |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.3 mm |
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Dimensions/Width: | 7.5 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Cut Tape (CT) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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