Technical parameters/rise/fall time: | 3 µs |
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Technical parameters/output voltage: | 40.0 V |
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Technical parameters/number of channels: | 1 |
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Technical parameters/number of pins: | 4 |
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Technical parameters/forward voltage: | 1.4V (Max) |
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Technical parameters/input current: | 50 mA |
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Technical parameters/dissipated power: | 0.15 W |
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Technical parameters/rise time: | 3 µs |
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Technical parameters/isolation voltage: | 3.75 kV |
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Technical parameters/forward current: | 50 mA |
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Technical parameters/output voltage (Max): | 40 V |
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Technical parameters/input current (Min): | 50 mA |
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Technical parameters/breakdown voltage: | 6 V |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 3 µs |
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Technical parameters/operating temperature (Max): | 110 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 150 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | 4-Mini-Flat |
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Dimensions/Height: | 2.2 mm |
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Dimensions/Packaging: | 4-Mini-Flat |
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Physical parameters/operating temperature: | -40℃ ~ 110℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Power Management, Signal Processing, Communications & Networking |
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Compliant with standards/RoHS standards: | RoHS Compliant Alternative material
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