Technical parameters/power supply voltage (DC): | 3.00V ~ 18.0V |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/output current: | 6.8 mA |
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Technical parameters/number of circuits: | 2 |
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Technical parameters/number of pins: | 14 |
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Technical parameters/digits: | 2 |
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Technical parameters/transmission delay time: | 250 ns |
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Technical Parameters/Voltage Wave Node: | 5.00 V, 10.0 V, 15.0 V |
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Technical parameters/dissipated power: | 500 mW |
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Technical parameters/number of logic gates: | 2 |
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Technical parameters/output current drive: | -1.00 mA |
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Technical parameters/number of inputs: | 4 |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/power supply voltage: | 3V ~ 18V |
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Technical parameters/power supply voltage (Max): | 18 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | SOIC-14 |
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Dimensions/Length: | 8.65 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-14 |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Defense, Military, and Aviation |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant wi Alternative material
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