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Model BAT54C,215

Description 200mA 至 500mA，NXP Semiconductors 高效超小薄型表面安装封装经优化适用于低正向电压降和高结温低电容可忽略的功率切换损耗低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。

Brand: NXP

Packaging SOT-23-3

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

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Technical parameters/number of pins:	3
Technical parameters/forward voltage:	800mV @100mA
Technical parameters/reverse recovery time:	5 ns
Technical parameters/forward current:	200 mA
Technical parameters/Maximum forward surge current (Ifsm):	600 mA
Technical parameters/forward voltage (Max):	800mV @100mA
Technical parameters/forward current (Max):	200 mA
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-65 ℃
Technical parameters/operating temperature:	150℃ (Max)
Technical parameters/dissipated power (Max):	250 mW
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	3
Encapsulation parameters/Encapsulation:	SOT-23-3
Dimensions/Length:	3 mm
Dimensions/Width:	1.4 mm
Dimensions/Height:	1 mm
Dimensions/Packaging:	SOT-23-3
Physical parameters/operating temperature:	125 ℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Other/Manufacturing Applications:	Consumer Electronics, Power Management, Consumer Electronics, Industrial, Industrial, Portable Devices, Portable Equipment, Power Management
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/12/17

Alternative material

Model	Brand	Similarity	Encapsulation	Introduction	Data manual
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BAT54C-7-F	Multicomp	功能相似	SOT-23	二极管与整流器	PDF