Technical parameters/frequency: | 1 MHz |
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Technical parameters/power supply voltage (DC): | 12.0V (min) |
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Technical parameters/number of output interfaces: | 2 |
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Technical parameters/output voltage: | 2 V |
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Technical parameters/output current: | 500 mA |
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Technical parameters/power supply current: | 36 mA |
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Technical parameters/number of pins: | 16 |
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Technical parameters/input current: | 28 mA |
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Technical parameters/adjusted output: | 2 |
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Technical parameters/rise time: | 20 ns |
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Technical parameters/switching frequency: | 1000 kHz |
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Technical parameters/topology structure: | Boost, Flyback, Forward, Full-Bridge, Half-Bridge, Push-Pull |
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Technical parameters/duty cycle: | 50 % |
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Technical parameters/output current (Max): | 2 A |
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Technical parameters/maximum duty cycle: | 50 % |
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Technical parameters/descent time: | 20 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 12V ~ 20V |
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Technical parameters/power supply voltage (Max): | 20 V |
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Technical parameters/power supply voltage (Min): | 12 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.28 mm |
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Dimensions/Width: | 7.52 mm |
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Dimensions/Height: | 2.35 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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