Technical parameters/number of output interfaces: | 2 |
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Technical parameters/Input voltage (DC): | 5.50 V |
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Technical parameters/output voltage: | ≤6.00 V |
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Technical parameters/output current: | 500 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 585.82 mW |
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Technical parameters/rise time: | 600 µs |
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Technical parameters/Input voltage (Max): | 5.5 V |
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Technical parameters/input voltage (Min): | 2.7 V |
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Technical parameters/output current (Max): | 500 mA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 585.82 mW |
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Technical parameters/input voltage: | 5.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | power management |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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Customs information/ECCN code: | EAR99< Alternative material
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