Technical parameters/rated voltage (DC): | 12.0 V |
|
Technical parameters/rated power: | 300 W |
|
Technical parameters/clamp voltage: | 24 V |
|
Technical parameters/test current: | 1 mA |
|
Technical parameters/peak pulse power: | 300 W |
|
Technical parameters/minimum reverse breakdown voltage: | 13.3 V |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | SOIC-16 |
|
Dimensions/Length: | 10.1 mm |
|
Dimensions/Width: | 4.01 mm |
|
Dimensions/Height: | 1.75 mm |
|
Dimensions/Packaging: | SOIC-16 |
|
Physical parameters/operating temperature: | -55℃ ~ 150℃ (TJ) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bag |
|
Other/Manufacturing Applications: | General |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SM1612C/TR13
|
Microsemi | 完全替代 | SOIC-16 |
TVS DIODE 12V 24V 16SO
|
||
SM16LC12C/TR13
|
Microchip | 完全替代 | SO-16 |
DIODE ARRAY BID 300W 12V 16SOIC
|
||
SM16LC12C/TR13
|
Microsemi | 完全替代 | SO-16 |
DIODE ARRAY BID 300W 12V 16SOIC
|
||
|
|
Microsemi | 功能相似 | DO-214AC |
SMAJ 24V 500W
|
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