Technical parameters/minimum current amplification factor (hFE): | 150 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/dissipated power (Max): | 1000 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 4 |
|
Encapsulation parameters/Encapsulation: | UPAK |
|
Dimensions/Length: | 4.6 mm |
|
Dimensions/Width: | 2.6 mm |
|
Dimensions/Height: | 1.6 mm |
|
Dimensions/Packaging: | UPAK |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | PB free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBSS4250X,115
|
NXP | 功能相似 | SOT-89-3 |
NXP PBSS4250X,115 单晶体管 双极, NPN, 50 V, 100 MHz, 550 mW, 2 A, 300 hFE
|
||
PBSS4250X,135
|
Nexperia | 功能相似 | SOT-89-3 |
SOT-89 NPN 50V 2A
|
||
PBSS4250X,135
|
NXP | 功能相似 | SOT-89-3 |
SOT-89 NPN 50V 2A
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review