Technical parameters/dissipated power: | 25000 mW |
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Technical parameters/operating temperature (Max): | 200 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Technical parameters/dissipated power (Max): | 25000 mW |
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Package parameters/number of pins: | 3 |
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Encapsulation parameters/Encapsulation: | TO-66 |
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Dimensions/Height: | 8.64 mm |
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Dimensions/Packaging: | TO-66 |
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Physical parameters/materials: | Silicon |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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