Chip AI consultant
Technical parameters/rise/fall time: | 24ns, 10ns |
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Technical parameters/number of channels: | 2 |
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Technical parameters/forward voltage: | 1.5 V |
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Technical parameters/dissipated power: | 60 mW |
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Technical parameters/rise time: | 0.024 µs |
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Technical parameters/isolation voltage: | 3750 Vrms |
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Technical parameters/forward voltage (Max): | 1.75 V |
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Technical parameters/forward current (Max): | 15 mA |
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Technical parameters/descent time: | 0.01 µs |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 60 mW |
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Technical parameters/power supply voltage: | 4.5V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 3.18 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Microprocessor System Interfaces, Ground Loop Elimination, Pulse Transformer Replacement, Digital Isolation for A/D, D/A Conversion, Isolated Line Receiver, Computer-Peripheral Interfaces, Instrument Input/Output Isolation, Switching Power Supply |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-0630#500
|
Broadcom | 功能相似 | SOIC-8 |
高速光耦合器 10MBd 2Ch 5mA
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