Technical parameters/number of output interfaces: | 8 |
|
Technical parameters/number of circuits: | 1 |
|
Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/dissipated power (Max): | 750 mW |
|
Technical parameters/power supply voltage: | 3.135V ~ 3.465V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP-16 |
|
Dimensions/Packaging: | TSSOP-16 |
|
Physical parameters/operating temperature: | 0℃ ~ 70℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY2DL814ZXCT
|
Cypress Semiconductor | 完全替代 | TSSOP-16 |
COMLINK ™系列 ComLink⑩ Series
|
||
CY2DL814ZXI
|
Cypress Semiconductor | 类似代替 | TSSOP-16 |
COMLINK ™系列 ComLink⑩ Series
|
||
CY2DL814ZXIT
|
Cypress Semiconductor | 类似代替 | TSSOP-16 |
COMLINK ™系列 ComLink⑩ Series
|
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