Technical parameters/capacitance: | 19.9 pF |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | SOD-323 |
|
Dimensions/Length: | 1.8 mm |
|
Dimensions/Width: | 1.35 mm |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | SOD-323 |
|
Physical parameters/operating temperature: | -55℃ ~ 125℃ (TJ) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BB208-03,115
|
NXP | 完全替代 | SOD-323 |
NXP BB208-03,115 变容二极管, Cd最大23.2pF, 20mA, 10V
|
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