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Model BAS16L,315

Description NXP Semiconductors ### 特点支持自定义高密度电路设计提供低泄漏和高电压类型高切换速度低电容 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。

Brand: NXP

Packaging SOD-882

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

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Technical parameters/number of pins:	2
Technical parameters/forward voltage:	1.25V @150mA
Technical parameters/thermal resistance:	500℃/W (RθJA)
Technical parameters/reverse recovery time:	4 ns
Technical parameters/forward current:	215 mA
Technical parameters/Maximum forward surge current (Ifsm):	4 A
Technical parameters/forward voltage (Max):	1.25 V
Technical parameters/forward current (Max):	215 mA
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-65 ℃
Technical parameters/operating temperature:	150℃ (Max)
Technical parameters/dissipated power (Max):	250 mW
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	2
Encapsulation parameters/Encapsulation:	SOD-882
Dimensions/Length:	1.02 mm
Dimensions/Width:	0.62 mm
Dimensions/Height:	0.47 mm
Dimensions/Packaging:	SOD-882
Physical parameters/operating temperature:	-65℃ ~ 150℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/12/17

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