Technical parameters/rated current: | 30.0 A |
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Technical parameters/load current: | 30 mA |
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Technical parameters/number of pins: | 2 |
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Technical parameters/forward voltage: | 410mV @1mA |
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Technical parameters/dissipated power: | 400 mW |
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Technical parameters/thermal resistance: | 320℃/W (RθJA) |
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Technical parameters/reverse recovery time: | 1 ns |
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Technical parameters/Maximum reverse voltage (Vrrm): | 60 V |
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Technical parameters/forward current: | 30 mA |
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Technical parameters/Maximum forward surge current (Ifsm): | 2 A |
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Technical parameters/maximum reverse leakage current (Ir): | 0.2 uA at 50 V |
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Technical parameters/forward voltage (Max): | 410mV @1mA |
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Technical parameters/forward current (Max): | 30 mA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Technical parameters/operating temperature: | 125℃ (Max) |
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Technical parameters/dissipated power (Max): | 400 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | Mini-MELF |
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Dimensions/Length: | 3.7 mm |
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Dimensions/Width: | 1.6 mm |
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Dimensions/Height: | 1.6 mm |
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Dimensions/Packaging: | Mini-MELF |
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Physical parameters/operating temperature: | -65℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Minimum Packaging: | 2500 |
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Other/Manufacturing Applications: | power management |
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