Technical parameters/power supply voltage (DC): | 2.80V (min) |
|
Technical parameters/power supply current: | 150 µA |
|
Technical parameters/number of pins: | 8 |
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Technical parameters/digits: | 13 |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.8 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | TSSOP |
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Dimensions/Length: | 3.1 mm |
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Dimensions/Width: | 3.1 mm |
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Dimensions/Height: | 0.95 mm |
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Dimensions/Packaging: | TSSOP |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Cut Tape (CT) |
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Other/Manufacturing Applications: | Computers & Computer Peripherals, Computers and computer peripherals, Industrial, Thermal Management, Industrial, Sensing and Instrumentation, Thermal Management, Sensing& Instrumentation |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SE95D,112
|
NXP | 类似代替 | SOIC-8 |
NXP SE95D,112 温度传感器芯片, 数字式, ± 3°C, -55 °C, 125 °C, SOIC, 8 引脚
|
||
SE95DP,118
|
NXP | 类似代替 | TSSOP-8 |
NXP SE95DP,118 芯片, 数字式温度传感器 芯片, 11位, ±3°C, TSSOP-8, 整卷
|
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