Technical parameters/power supply voltage (DC): | 3.30 V, 3.60 V (max) |
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Technical parameters/digits: | 16 |
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Technical parameters/access time: | 10 ns |
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Technical parameters/memory capacity: | 2000000 B |
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Technical parameters/access time (Max): | 10 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 3.135V ~ 3.6V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 44 |
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Encapsulation parameters/Encapsulation: | TSOP-44 |
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Dimensions/Packaging: | TSOP-44 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: |
| |
Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61LV12816L-10TL
|
Integrated Silicon Solution | 功能相似 | TSOP-44 |
INTEGRATED SILICON SOLUTION (ISSI) IS61LV12816L-10TL 芯片, SRAM, 高速异步型 128K x 16
|
||
IS61LV12816L-10TL-TR
|
Integrated Silicon Solution | 类似代替 | TSOP-44 |
2Mb, High-Speed, Async, 128K x 16, 10ns, 3.3V, 44Pin Tsop Ii, Lea
|
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