Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Package parameters/number of pins: | 165 |
|
Encapsulation parameters/Encapsulation: | FBGA-165 |
|
Dimensions/Packaging: | FBGA-165 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS8662TT20BD-500
|
GSI | 功能相似 |
SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165Pin FBGA
|
|||
GS8662TT20BD-500I
|
GSI | 功能相似 | 165 |
SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165Pin FBGA
|
||
GS8662TT20BGD-500
|
GSI | 功能相似 | FBGA-165 |
静态随机存取存储器 1.8 or 1.5V 4M x 18 72M
|
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