Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA Cyclone® Family 20060 Cells 405.2MHz 130nm Technology 1.5V 324Pin FBGA
|
||
EP1C20F324C6N
|
Altera | 类似代替 | FBGA-324 |
FPGA Cyclone® Family 20060 Cells 405.2MHz 130nm Technology 1.5V 324Pin FBGA
|
||
EP1C20F324C6N
|
Intel | 类似代替 | BGA |
FPGA Cyclone® Family 20060 Cells 405.2MHz 130nm Technology 1.5V 324Pin FBGA
|
||
|
|
Intel | 类似代替 | BGA |
FPGA - 现场可编程门阵列 FPGA - Cyclone I 2006 LABs 233 IOs
|
||
EP1C20F324C8N
|
Altera | 类似代替 | FBGA-324 |
FPGA - 现场可编程门阵列 FPGA - Cyclone I 2006 LABs 233 IOs
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review