Technical parameters/Contact electroplating: | Gold |
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Technical parameters/Insulation resistance: | >1000 MΩ |
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Technical parameters/Input voltage (DC): | 12.0 V |
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Technical parameters/contact type: | DPDT |
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Technical parameters/power consumption: | 200 mW |
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Technical parameters/Contact rated current: | 1.25 A |
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Technical parameters/coil voltage: | 12 VDC |
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Technical parameters/coil current: | 16.67 mA |
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Technical parameters/coil power (DC): | 200 mW |
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Technical parameters/coil resistance: | 720 Ω |
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Technical parameters/rated current (Max): | 2 A |
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Technical parameters/coil voltage (DC): | 12 V |
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Technical parameters/coil power: | 200 mW |
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Technical parameters/rated power (Max): | 60W, 62.5VA |
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Technical parameters/Switching current (Max): | 2 A |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/rated voltage (DC Max): | 220 V |
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Technical parameters/rated voltage (AC Max): | 250 V |
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Technical parameters/Contact resistance (Max): | <70 mΩ |
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Encapsulation parameters/installation method: | Through Hole |
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Encapsulation parameters/Encapsulation: | DIP |
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Dimensions/Length: | 15 mm |
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Dimensions/Width: | 9.6 mm |
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Dimensions/Height: | 7.5 mm |
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Dimensions/Packaging: | DIP |
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Physical parameters/contact material: | Palladium, Ruthenium, Gold |
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Physical parameters/operating temperature: | -55℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods:< Alternative material
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