Technical parameters/rise time: | 30000 ns |
|
Technical parameters/descent time: | 35000 ns |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/dissipated power (Max): | 65000 mW |
|
Package parameters/number of pins: | 3 |
|
Encapsulation parameters/Encapsulation: | D2PAK-263 |
|
Dimensions/Packaging: | D2PAK-263 |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BUK129-50DL
|
NXP | 功能相似 | D2PAK |
Logic level TOPFET SMD version of BUK118-50DL
|
||
BUK129-50DL
|
Philips | 功能相似 |
Logic level TOPFET SMD version of BUK118-50DL
|
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