Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 3 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4050AEM3-2.1+T
|
Maxim Integrated | 功能相似 | SOT-23-3 |
50PPM / A ° C精密微功耗并联电压基准,带有多种反向击穿电压 50ppm/°C Precision Micropower Shunt Voltage References with Multiple Reverse Breakdown Voltages
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review